TKM MEMBRANE TECHNOLOGY LTD. 86-0769-82659918-1062 amy@foundationfe.com

Double-Sided Flexible Printing Membrane Printed FPC Circuit

Làm nổi bật

double-sided FPC circuit membrane
,
flexible printing membrane switch
,
printed FPC circuit switch
Mẫu số

HC-FPC-002
Chế độ kết hợp

Tấm linh hoạt dính
Chất kết dính dẫn điện

Dán bạc dẫn điện
chất chống cháy

HB
Công nghệ chế biến

lá điện phân
Vật liệu cơ bản

Nhôm
Vật liệu cách nhiệt

nhựa hữu cơ
Độ dày trung bình

1.1-0. Là
Loại lá đồng

Điện phân và cán
Độ dày lá đồng

1oz, 1/2oz, 1/3oz
Độ dày màng nền

1 triệu, 1/2 triệu
Độ dày màng bọc

1 triệu, 1/2 triệu
Độ dày chất làm cứng

3 triệu đến 9 triệu
Năng lực sản xuất

100.000pcs/tháng
Mã HS

8536500000
Số lượng đặt hàng tối thiểu

100

Double-Sided Flexible Printing Membrane Printed FPC Circuit

Name: Double-Sided Flexible Printing Membrane Printed FPC Circuit
Brand: TKM MEMBRANE TECHNOLOGY LTD.
Availability: InStock

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Nhận giá Liên hệ với bây giờ

Double-Sided Flexible Printing Membrane Printed FPC Circuit

Double-sided flexible printed circuit (FPC) boards offer exceptional flexibility and reliability for advanced electronic applications requiring compact, lightweight solutions.

Key Features and Benefits

Exceptional Flexibility: Can be bent, folded, and deformed freely with small coil radius and movement along X, Y, Z axes
Space-Saving Design: Light and thin construction (average thickness 1.1-0.1mm) maximizes use of narrow instrument spaces
Lightweight Construction: Optimized for current load rather than mechanical strength, resulting in minimal weight
Superior Sealing Capability: Designed for low-tensile seal performance in adverse environments
Stable Signal Transmission: Freely designed wiring patterns and conductor distances ensure steady RLC parameters
Easy Assembly: Excellent terminal properties for soldering, inserting, riveting, and gluing applications
Enhanced Insulation: Materials like polyimide and polyester provide superior insulation properties

Material Composition

Copper Foil Substrate:

Copper Foil: Electrolytic copper and rolled copper (common thickness: 1oz, 1/2oz, 1/3oz)
Substrate Film: Common thickness of 1mil and 1/2mil
Adhesive: Thickness customized to customer requirements

Cover Film Protection:

Cover Film: Surface insulation (common thickness: 1mil and 1/2mil)
Adhesive: Thickness customized to customer requirements
Prevents adhesive buildup and foreign matter before pressing

Stiffener (PI Stiffener Film):

Reinforces mechanical strength for surface mounting
Common thickness: 3mil to 9mil
Adhesive: Thickness customized to customer requirements

EMI Shielding: Electromagnetic shielding film protects circuit board lines from external interference in high electromagnetic environments.

Competitive Advantages

Shorter Assembly Time: Complete line configuration eliminates extra PCB wiring connection work
Compact Size: Small volume PCB effectively reduces product dimensions
Lightweight: Significantly lighter than traditional rigid PCBs
Thin Profile: Thinner than hard PCB boards, improving flexibility and 3D assembly capabilities
Quick Delivery
Premium Services
OEM/ODM Customization Available

Application Images